Abstract:
Ni-Cu-P Coating Was Deposited On 99.99% Pure Copper Substrate Electrolessly. The Central Composite Design Of Experiment Has Been Considered As The Statistical Analysis Tool. The Variation In Surface Roughness Is Studied By Varying Three Parameters Ni-Ion Concentration, Cu-Ion Concentration And Reducing Agent Concentration Of The Chemical Bath. The Surface Roughness Is Considered As The Response In Student�s T Test And It Has Been Observed That The Ni �Ion Source And Cu-Ion Source Significantly Influence The Surface Roughness At 10% Level Of Significance. Also All The Main Effects (Ni-Ion Source, Cu-Ion Source, Reducing Ion Source) And The Interaction Of Ni-Ion And Reducing Agent, Significantly Influence The Surface Roughness At 20% Level Of Significance. A Mathematical Model Has Developed Considering Second Order Response Surface Methodology Which Further Considers The Main Effects As Well As The Effects Of Interaction And The Effects Of Curvatures.
Keywords:Student�s T Test, Electroless Ni-Cu-P Coating, RSM, CCD